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            Nearly 15-year Experience of Electronics Manufacturing

            SATECH provides one-stop PCB assembly services for electronics manufacturing, from components sourcing, PCB production, SMT, DIP, PCB assembly to finished-product assembly. With the superiority of large-scale purchasing (of IC, resistances, capacitance, inductance, diode and audion,etc.) and quality-first sense, we contract with the excellent component manufacturers from home and aboard to build long-term partnership, this makes sure of original quality and stable supply, aiming at transmitting the benefit to our clients. We have been working for the clients from US, Germany, Russia, Yemen, UAE, Japan, Spain, France, Italy, Israel, Iran, India, Mexico, Argentina, Colombia, etc. 

            Turnkey PCB Board Assembly Solutions
            Rapid Turnaround  Prototype/Production Support  Blank Boards»Components»Assembly  Rapid On-line Quote
            Since starting in 2003, SATECH has emerged as a trustworthy electronic contract manufacturer (ECM) to meet the demand of fast turnkey PCB assembly solutions. No matter whether it is a sample order or bulk order, we are always effective at reviewing and analyzing BOM and technical files, and quick to source components for rapid quotation. For the production and QC steps, some strict rules and regulations and KPI are available for every facility manager and worker. No quality for you, no life for us.

            Ability of manufacturing PCB Assembly Service Facility List
            4 SMT processing lines Circuit board production (up to 12 layers, impedance, HDI, etc.)  Fuji CP8 Series Surface-mount Machine
            3 DIP processing lines SMT/DIP Automated solder-paste printer
            0201 components assy ICT (In-Circuit Test) 10-zone Re-flow Soldering
            0.25mm BGA FCT (Functional Circuit Test) AOI Detector
            Surface-mount 4 million pins/day BIT (Burn-in Test) Wave-soldering 
            DIP 1 million pins/day Box Building ICT Working Platform

            Supported Assembly Capabilities

            Different types of Assembly
            °THD (Thru-Hole Device)
            °SMT (Surface-Mount Technology)
            °SMT & THD combined
            °2-sided SMT and THD assembly

            Order Volume Allowed
            °1 to 5,000 boards

            °Passives parts, smallest size 0201
            °Fine pitch to 8 Mils
            °BGA, uBGA, QFN, POP and Zero-Lead chips
            °Connectors and terminals

            Component Package
            °Cut tape
            °Tube and tray
            °Loose parts and bulk

            PCB Board Measurements
            °Minimum measurement: 0.2″ x 0.2″ (5mm x 5mm)
            °Largest dimension: 15″ x 20″ (381mm x 508mm)

            Printed circuit board shapes
            °Slots and Cut outs
            °Complicated and Uncommon

            PCB board kinds
            °Rigid FR-4 boards
            °Rigid-Flex boards

            Assy procedures
            °Leaded process
            °Zero-Lead (RoHS)

            Design file formatting
            °Gerber RS-274X, 274D, Eagle as well as AutoCAD’s DXF, DWG
            °BOM (Bill of Materials) (.xls, .csv, . xlsx)
            °Centroid (Pick-N-Place Or XY file)

            Testing Processes
            °Visual Inspection
            °X-ray Inspection
            °AOI (Also known as: Automated Optical Inspection)
            °ICT (AKA: In-Circuit Test)
            °Functional testing

            Turnaround time periods
            °1 To 5 days for only printed circuit board assy
            °10 To16 days for full Turnkey Circuit Card Assy